emz1 / umz1n / imz1a transistors rev.a 1/4 general purpose transistor (dual transistors) emz1 / umz1n / imz1a z features 1) both a 2sa1037ak chip and 2sc2412k chip in a emt or umt or smt package. 2) mounting possible with emt3 or umt3 or smt3 automatic mounting machines. 3) transistor elements are independent, eliminating interference. 4) mounting cost and area can be cut in half. z structure npn / pnp epitaxial planar silicon transistor z equivalent circuit emz1 / umz1n imz1a (3) (2) (1) (4) (6) (5) tr 2 tr 1 (3) (2) (1) (4) (6) (5) tr 2 tr 1 z absolute maximum ratings (ta = 25 c) parameter symbol limits tr 1 tr 2 unit v cbo 60 v 50 vv v ceo v ebo 7 i c ma 150 ? 60 ? 50 ? 6 ? 150 tj 150 ?c tstg ? 55 to + 150 ?c p c emz1, umz1n 150 (total) mw imz1a 300 (total) ? 1 ? 2 collector-base voltagecollector-emitter voltage emitter-base voltage collector current junction temperature storage temperature powerdissipation ? 1 120mw per element must not be exceeded. ? 2 200mw per element must not be exceeded. z external dimensions (unit : mm) rohm : emt6 emz1 rohm : umt6eiaj : sc-88 umz1n abbreviated symbol : z1 abbreviated symbol : z1 abbreviated symbol : z1 rohm : smt6eiaj : sc-74 imz1a each lead has same dimensions each lead has same dimensions each lead has same dimensions 0to0.1 ( 6 ) 2.0 1.3 0.9 0.15 0.7 0.1min. 2.1 0.65 0.2 1.25 ( 1 ) 0.65 ( 4 ) ( 3 ) ( 2 ) ( 5 ) ( 6 ) ( 5 ) ( 4 ) 0.3to0.6 0.15 0.3 1.1 0.8 0to0.1 ( 3 ) 2.8 1.6 1.9 2.9 0.95 ( 2 ) 0.95 ( 1 ) 0.22 1.21.6 ( 1 ) ( 2 ) ( 5 ) ( 3 ) ( 6 ) ( 4 ) 0.13 0.5 0.5 0.5 1.0 1.6 UMZ1NFHA imz1afra emz1fha emz1fha / UMZ1NFHA 2sa1037akfra 2sc2412kfra emz1fha / UMZ1NFHA / imz1afra emz1fha / UMZ1NFHA imz1afra imz1afra emz1fha / UMZ1NFHA / imz1afra aec-q101 qualified downloaded from: http:///
emz1 / umz1n / imz1a transistors rev.a 2/4 z electrical characteristics (ta = 25 c) tr 1 (npn) parameter symbol bv cbo bv ceo bv ebo i cbo i ebo h fe v ce (sat) cob min. 6050 7 ?? 120 ?? ?? ? ? ? ? ? 2 ?? ? 0.10.1 560 0.43.5 v i c = 50 a i c = 1ma i e = 50 a v cb = 60v v eb =7 v v ce = 6v, i c = 1ma i c /i b = 50ma/5ma vv a a ? v pf typ. max. unit conditions f t ? 180 ? v ce = 12v, i e = ? 2ma, f = 100mhz v cb = 12v, i e = 0a, f = 1mhz mhz collector-base breakdown voltagecollector-emitter breakdown voltage emitter-base breakdown voltage collector cutoff current emitter cutoff current dc current transfer ratio transition frequency collector-emitter saturation voltageoutput capacitance tr 2 (pnp) parameter symbol bv cbo bv ceo bv ebo i cbo i ebo h fe v ce (sat) cob min. ? 60 ? 50 ? 6 ?? 120 ?? ?? ? ? ? ? ? 4 ?? ? ? 0.1 ? 0.1 560 ? 0.5 5 vi c = ? 50 a i c = ? 1ma i e = ? 50 a v cb = ? 60v v eb = ? 6 v v ce = ? 6v, i c = ? 1ma i c /i b = ? 50ma/ ? 5ma vv a a ? v pf typ. max. unit conditions f t ? 140 ? v ce = ? 12v, i e = 2ma, f = 100mhz v cb = ? 12v, i e = 0a, f = 1mhz mhz collector-base breakdown voltagecollector-emitter breakdown voltage emitter-base breakdown voltage collector cutoff current emitter cutoff current dc current transfer ratio transition frequency collector-emitter saturation voltageoutput capacitance z packaging specifications package code tr t108 3000 3000 taping basic ordering unit (pieces) umz1n t2r 8000 emz1imz1a type z electrical characteristic curves tr 1 (npn) 0 0.1 0.2 0.5 2 20 50 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 5 10 ta=100?c v ce = 6v 25?c ? 55?c collector current : i c ( ma) base to emitter voltage : v be (v) fig.1 grounded emitter propagation characteristics 0 20 40 60 80 100 0.4 0.8 1.2 1.6 2.0 0 0.05ma 0.10ma 0.15ma 0.25ma 0.30ma 0.35ma 0.20ma ta=25?c i b =0a 0.40ma 0.50ma 0.45ma collector current : i c (ma) collector to emitter voltage : v ce (v) fig.2 grounded emitter output characteristics ( i ) 0 0 2 8 10 4 8 12 16 4 6 20 i b =0a ta=25?c 3 a 6 a 9 a 12 a 15 a 18 a 21 a 24 a 27 a 30 a collector current : i c (ma) collector to emitter voltage : v ce (v) fig.3 grounded emitter output characteristics ( ii ) UMZ1NFHA imz1afra emz1fha emz1fha / UMZ1NFHA / imz1afra downloaded from: http:///
emz1 / umz1n / imz1a transistors rev.a 3/4 0.2 2010 0.5 1 2 5 10 20 50 100 200 50 100 200 500 v ce =5v 3v 1v ta=25?c dc current gain : h fe collector current : i c (ma) fig.4 dc current gain vs. collector current ( i ) 0.2 0.5 1 2 5 10 20 50 100 200 2010 50 100 200 500 25?c ? 55?c ta=100?c v ce =5v dc current gain : h fe collector current : i c (ma) fig.5 dc current gain vs. collector current ( ii ) 0.2 0.01 0.02 0.05 0.1 0.2 0.5 0.5 1 2 5 10 20 50 100 200 i c /i b =50 20 10 ta=25 ?c collector saturation voltage : v ce (sat) (v) collector current : i c (ma) fig.6 collector-emitter saturation voltage vs. collector current ( i ) 0.2 0.01 0.02 0.05 0.1 0.2 0.5 0.5 1 2 5 10 20 50 100 200 i c /i b =10 ta=100?c 25?c ? 55?c collector saturation voltage : v ce (sat) (v) collector current : i c (ma) fig.7 collector-emitter saturation voltage vs. collector current ( ii ) 0.2 0.01 0.02 0.05 0.1 0.2 0.5 0.5 1 2 5 10 20 50 100 i c /i b =50 ta=100?c 25?c ? 55?c collector saturation voltage : v ce (sat) (v) collector current : i c (ma) fig.8 collector-emitter saturation voltage vs. collector current ( iii ) 50 ? 0.5 ? 1 ? 2 ? 5 ? 10 ? 20 ? 50 ? 100 100 200 500 ta=25?c v ce =6v emitter current : i e (ma) transition frequency : f t (mhz) fig.9 gain bandwidth product vs. emitter current 0.2 0.5 1 2 5 10 20 50 1 2 5 10 20 cib cob collector to base voltage : v cb (v) emitter to base voltage : v eb (v) collector output capacitance : cob (pf) emitter input capacitance : cib (pf) fig.10 collector output capacitance vs. collector-base voltage emitter input capacitance vs. emitter-base voltage ta=25?c f = 1mhz i e =0a i c =0a ? 0.2 ? 0.5 ? 1 ? 2 ? 5 ? 10 10 20 50 100 200 emitter current : i e (ma) fig.11 base-collector time constant vs. emitter current base collector time constant : cc r bb' (ps) ta=25 ?c f=32mh z v cb =6v emz1fha / UMZ1NFHA / imz1afra downloaded from: http:///
emz1 / umz1n / imz1a transistors rev.a 4/4 tr 2 (pnp) ? 0.2 collector current : ic ( ma) ? 50 ? 20 ? 10 ? 5 ? 2 ? 1 ? 0.5 ? 0.2 ? 0.1 ? 0.4 ? 0.6 ? 0.8 ? 1.0 ? 1.2 ? 1.4 ? 1.6 v ce = ? 6v base to emitter voltage : v be (v) ta=100?c 25?c ? 40?c fig.12 grounded emitter propagation characteristics ? 0.4 ? 4 ? 8 ? 1.2 0 ? 2 ? 6 ? 10 ? 0.8 ? 1.6 ? 2.0 ? 3.5 a ? 7.0 ? 10.5 ? 14.0 ? 17.5 ? 21.0 ? 24.5 ? 28.0 ? 31.5 i b =0 ta=25?c ? 35.0 collector current : i c (ma) collector to emitter voltage : v ce (v) fig.13 grounded emitter output characteristics ( i ) ? 40 ? 80 ? 5 ? 3 ? 4 ? 2 ? 1 ? 20 ? 60 ? 100 0 i b =0 ta=25?c ? 50 a ? 100 ? 150 ? 200 ? 250 ? 500 ? 450 ? 400 ? 350 ? 300 collector current : i c (ma) collector to emitter voltage : v ce (v) fig.14 grounded emitter output characteristics ( ii ) dc current gain : h fe collector current : i c (ma) fig.15 dc current gain vs. collector current ( i ) 500200 100 50 ? 0.2 ? 0.5 ? 1 ? 2 ? 5 ? 10 ? 20 ? 50 ? 100 ta=25?c v ce = ? 5v ? 3v ? 1v 500200 100 50 ? 0.2 ? 0.5 ? 1 ? 2 ? 5 ? 10 ? 20 ? 50 ? 100 v ce = ? 6v ta=100?c ? 40?c 25?c dc current gain : h fe collector current : i c (ma) fig.16 dc current gain vs. collector current ( ii ) ? 0.1 ? 0.2 ? 0.5 ? 1 ? 2 ? 5 ? 10 ? 20 ? 50 ? 100 ? 1 ? 0.5 ? 0.2 ? 0.05 ta=25?c i c /i b =50 20 10 collector current : i c (ma) collector saturation voltage : v ce (sat) ( v) fig.17 collector-emitter saturation voltage vs. collector current ( i ) ? 0.1 ? 0.2 ? 0.5 ? 1 ? 2 ? 5 ? 10 ? 20 ? 50 ? 100 ? 1 ? 0.5 ? 0.2 ? 0.05 l c /l b =10 ta=100?c 25?c ? 40?c collector saturation voltage : v ce (sat) (v) collector current : i c (ma) fig.18 collector-emitter saturation voltage vs. collector current ( ii ) 50 100 0.5 20 50 100 200 500 1000 1 2 5 10 ta=25?c v ce = ? 12v emitter current : i e (ma) transition frequency : f t (mhz) fig.19 gain bandwidth product vs. emitter current -0.5 -20 2 5 10 -1 -2 -5 -10 20 cib cob collector to base voltage : v cb (v) emitter to base voltage : v eb (v) collector output capacitance : cob (pf) emitter input capacitance : cib (pf) fig.20 collector output capacitance vs. collector-base voltage emitter input capacitance vs. emitter-base voltage ta=25?c f = 1mhz i e =0a i c =0a emz1fha / UMZ1NFHA / imz1afra downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///
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